Description: Thread Locking Adhesive -ACETONE LR or AR GRADE:ACETONE LR or AR GRADE; XYLENE LR or AR GRADE:XYLENE LR or AR GRADE; NAOH PELLETS:NAOH PELLETS; APCOTEX XNB 300 SYNTHETIC ANIONIC EMULSION TOTAL SOLIDS 40PERCENT WT MIN PH 7 TO 9:APCOTEX XNB 300 SYNTHETIC ANIONIC EMULSION TOTAL SOLIDS 40PERCENT WT MIN PH 7 TO 9; TF 200 ADHESIVE:TF 200 ADHESIVE; VKR 85 ADHESIVE:VKR 85 ADHESIVE; ADHESIVE PFE 37 ANALOGUE 51 K 37:ADHESIVE PFE 37 ANALOGUE 51 K 37; HIGH PURITY SILICON HEXA BORIDE POWDER 3 TO 5 MICRON PURITY 99.9 PERCENT:HIGH PURITY SILICON HEXA BORIDE POWDER 3 TO 5 MICRON PURITY 99.9 PERCENT; LABOLENE NEUTRAL PH CAS NO 11043 TO 90 TO 6 QUALIGENS 5 LITERS:LABOLENE NEUTRAL PH CAS NO 11043 TO 90 TO 6 QUALIGENS 5 LITERS; SULPHURIC ACID 98 PERCENT PURE:SULPHURIC ACID 98 PERCENT PURE; CONC.NITRIC ACID 71 PERCENT PURITY:CONC.NITRIC ACID 71 PERCENT PURITY; HYDROCHLORIC ACID:HYDROCHLORIC ACID; CERAMIC MICROSHPERES PARTICLE SIZE 4 MICRON:CERAMIC MICROSHPERES PARTICLE SIZE 4 MICRON; CARBON BALCK GRADE N330 HAF:CARBON BALCK GRADE
Details: ACETONE LR or AR GRADE , XYLENE LR or AR GRADE , NAOH PELLETS , APCOTEX XNB 300 SYNTHETIC ANIONIC EMULSION TOTAL SOLIDS 40PERCENT WT MIN PH 7 TO 9 , TF 200 ADHESIVE , VKR 85 ADHESIVE , ADHESIVE PFE 37 ANALOGUE 51 K 37 , HIGH PURITY SILICON HEXA BORIDE POWDER 3 TO 5 MICRON PURITY 99.9 PERCENT , LABOLENE NEUTRAL PH CAS NO 11043 TO 90 TO 6 QUALIGENS 5 Item Category/ LITERS , SULPHURIC ACID 98 PERCENT PURE , CONC.NITRIC ACID 71 PERCENT PURITY , HYDROCHLORIC ACID , CERAMIC MICROSHPERES PARTICLE SIZE 4 MICRON , CARBON BALCK GRADE N330 HAF , CALCIUM CARBONATE PURITY 95 PERCENT , PLATINIUM O 1 AND 3 DIVINY1 TO 1 AND 1 AND 3 AND 3 TERAMETHYL DISILOXANE COMPLEX IN XYLENE SOLUTION PT2 PERCENT , BLUE ADHESIVE PRIMER , AMMONIA SOLUTION 25PERCENT FOR ANALYSIS