51178274 14 LAYER 2 33MM FOILMETHOD JD3 120558549

The Department of Defence Production has published a tender for "51178274 14 LAYER-2.33MM-FOILMETHOD, JD3MC GRAPHICS CARD P/N: M1020103002, M/s. MICROPACK,51178349 14 LAYER-1.6MM-FOILMETHOD, JD3MC IOTP2 CARD P/N M1020107002 PKG Micro Pack,51178478 PCB, 14 LAYER-1.86MM-FOILMETHOD, Grade: MIL-PRF-55100G, JD3MC IOTP3 CARD, P/N M102010,51178610 18 LAYER- 2.3m± 10% Foilmethod, JD3MC Carrier Card P/N M1020102003 PKG MICROPACK,51178658 Card PCB, 12 Layered FR4 PCB, Thickness: 1.93mm Size: 143.75mm x 74mm, P/N: M1020105,51178757 Video Card PCB, M1020104002, 12LAYER-2MM-FOILMETHOD, P/N M1020104002, Grade: MIL-PRF-55110G (A,51178120 JD3MC ASIO CARD 12 layers, 2.38mm± 10% Thickness, P/N M1020106000 REV 00 MICRO PACK,51178151 18-LAYER-4.25MM-FOILMETHOD, JD3MC VPX BACKPLANE CARD. P/N: M1020101000, Mfg: Micropack.,51178197 12 LAYER-1.6MM-FOILMETHOD, JD3MC IOTP1 CARD P/N M1020107001 REV 00 PKG MICRO PACK" on the 12 May 2025. This tender belongs to Electronic Components category. This tender is published in Rangareddy, Telangana location. The vendors interested in this tender and related Electronic Components tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Tender Details
 Tender Title / Description
Tender Title 51178274 14 LAYER-2.33MM-FOILMETHOD, JD3MC GRAPHICS CARD P/N: M1020103002, M/s. MICROPACK,51178349 14 LAYER-1.6MM-FOILMETHOD, JD3MC IOTP2 CARD P/N M1020107002 PKG Micro Pack,51178478 PCB, 14 LAYER-1.86MM-FOILMETHOD, Grade: MIL-PRF-55100G, JD3MC IOTP3 CARD, P/N M102010,51178610 18 LAYER- 2.3m± 10% Foilmethod, JD3MC Carrier Card P/N M1020102003 PKG MICROPACK,51178658 Card PCB, 12 Layered FR4 PCB, Thickness: 1.93mm Size: 143.75mm x 74mm, P/N: M1020105,51178757 Video Card PCB, M1020104002, 12LAYER-2MM-FOILMETHOD, P/N M1020104002, Grade: MIL-PRF-55110G (A,51178120 JD3MC ASIO CARD 12 layers, 2.38mm± 10% Thickness, P/N M1020106000 REV 00 MICRO PACK,51178151 18-LAYER-4.25MM-FOILMETHOD, JD3MC VPX BACKPLANE CARD. P/N: M1020101000, Mfg: Micropack.,51178197 12 LAYER-1.6MM-FOILMETHOD, JD3MC IOTP1 CARD P/N M1020107001 REV 00 PKG MICRO PACK
Tender Description 51178274 14 layer-2.33mm-foilmethod, jd3mc graphics card p/n: m1020103002, m/s. micropack , 51178349 14 layer-1.6mm-foilmethod, jd3mc iotp2 card p/n m1020107002 pkg micro pack , 51178478 pcb, 14 layer-1.86mm-foilmethod, grade: mil-prf-55100g, jd3mc iotp3 card, p/n m102010 , 51178610 18 layer- 2.3m 10% foilmethod, jd3mc carrier card p/n m1020102003 pkg micropack , 51178658 card pcb, 12 layered fr4 pcb, thickness: 1.93mm size: item category/ 143.75mm x 74mm, p/n: m1020105 , 51178757 video card pcb, m1020104002, 12layer-2mm-foilmethod, p/n m1020104002, grade: mil-prf-55110g (a , 51178120 jd3mc asio card 12 layers, 2.38mm 10% thickness, p/n m1020106000 rev 00 micro pack , 51178151 18-layer- 4.25mm-foilmethod, jd3mc vpx backplane card. p/n: m1020101000, mfg: micropack. , 51178197 12 layer- 1.6mm-foilmethod, jd3mc iotp1 card p/n m1020107001 rev 00 pkg micro pack
Comments 51178274 14 layer-2.33mm-foilmethod, jd3mc graphics card p/n: m1020103002, m/s. micropack , 51178349 14 layer-1.6mm-foilmethod, jd3mc iotp2 card p/n m1020107002 pkg micro pack , 51178478 pcb, 14 layer-1.86mm-foilmethod, grade: mil-prf-55100g, jd3mc iotp3 card, p/n m102010 , 51178610 18 layer- 2.3m 10% foilmethod, jd3mc carrier card p/n m1020102003 pkg micropack , 51178658 card pcb, 12 layered fr4 pcb, thickness: 1.93mm size: item category/ 143.75mm x 74mm, p/n: m1020105 , 51178757 video card pcb, m1020104002, 12layer-2mm-foilmethod, p/n m1020104002, grade: mil-prf-55110g (a , 51178120 jd3mc asio card 12 layers, 2.38mm 10% thickness, p/n m1020106000 rev 00 micro pack , 51178151 18-layer- 4.25mm-foilmethod, jd3mc vpx backplane card. p/n: m1020101000, mfg: micropack. , 51178197 12 layer- 1.6mm-foilmethod, jd3mc iotp1 card p/n m1020107001 rev 00 pkg micro pack
 Important Dates
Published Date
Due Date 27 May 2025 00:00:00
 Estimate and EMD
Estimated Value 0.0
EMD 0 INR
Processing Fee 0 INR
 Document Links
 Purchasing Agency
 Tender No

TSID: 120558549

 Tender Type and Location
Tender Category
Tender Type
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