The ITI Limited has published a tender for "DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2822790S8T8-IC FPGA 170 I/O 256 FTBGA, Industrial Grade -40 to+ 100 deg. C,DA3B2822790S8T8-IC FPGA 170 I/O 256 FTBGA, Industrial Grade -40 to+ 100 deg. C,DA3B2822790S8T8-IC FPGA 170 I/O 256 FTBGA," on the 28 Nov 2025. This tender belongs to Electronic Components category. This tender is published in Bangalore, Karnataka location. The vendors interested in this tender and related Electronic Components tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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ITI Limited issued 54 tenders for Electronic Components last year
With, 0 floated just last month.
| Tender Title | DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3C1142736L1T9-IC PACKWOOD QUAD BUCK INTEGRATED 48 LFCSP,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2572742H1T2-IC FLASH 64 MBIT 50 MHZ 16 SOIC,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2922732F8TB-SINGLE CHIP POWER SOLUTIO FOR BATTERY POWERED SYSTEMS, -40 TO 105 DEG. C, PQFP PKG.,DA3B2822790S8T8-IC FPGA 170 I/O 256 FTBGA, Industrial Grade -40 to+ 100 deg. C,DA3B2822790S8T8-IC FPGA 170 I/O 256 FTBGA, Industrial Grade -40 to+ 100 deg. C,DA3B2822790S8T8-IC FPGA 170 I/O 256 FTBGA, |
|---|---|
| Tender Description | da3c1142736l1t9-ic packwood quad buck integrated 48 lfcsp , da3b2572742h1t2-ic flash 64 mbit 50 mhz 16 soic , da3b2922732f8tb-single chip power solutio /item category for battery powered systems, -40 to 105 deg. c, pqfp pkg. , da3b2822790s8t8-ic fpga 170 i/o 256 ftbga, industrial grade -40 to+ 100 deg. c |
| Comments | da3c1142736l1t9-ic packwood quad buck integrated 48 lfcsp , da3b2572742h1t2-ic flash 64 mbit 50 mhz 16 soic , da3b2922732f8tb-single chip power solutio /item category for battery powered systems, -40 to 105 deg. c, pqfp pkg. , da3b2822790s8t8-ic fpga 170 i/o 256 ftbga, industrial grade -40 to+ 100 deg. c |
| Published Date | |
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| Due Date | 08 Dec 2025 00:00:00 |
| Estimated Value | 0.0 |
|---|---|
| EMD | 0 INR |
| Processing Fee | 0 INR |