The Hindustan Aeronautics Limited has published a tender for "PROC CARD G3INS_ SOC_ V3 Processor board PROCESSOR- CARD- G3INS_ SOC_ V3, Number of Layers: 20, Thicknes,G3INS MOTHER BOARD Mother Board PCB G3INS-MOTHER- BOARD AIRCRAFTS_ V8, Number of Layers: 14, Thicknes" on the 29 Mar 2026. This tender belongs to Electronic Components category. This tender is published in Lucknow, Uttar Pradesh location. The vendors interested in this tender and related Electronic Components tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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| Tender Title | PROC CARD G3INS_ SOC_ V3 Processor board PROCESSOR- CARD- G3INS_ SOC_ V3, Number of Layers: 20, Thicknes,G3INS MOTHER BOARD Mother Board PCB G3INS-MOTHER- BOARD AIRCRAFTS_ V8, Number of Layers: 14, Thicknes |
|---|---|
| Tender Description | proc card g3ins_ soc_ v3 processor board processor- card- g3ins_ soc_ v3, number of layers: 20, thicknes , /item category g3ins mother board mother board pcb g3ins-mother- board aircrafts_ v8, number of layers: 14, thicknes g3ins mother board mother board pcb g3ins-mother- board aircrafts_v8, number of layers: 14, thickness: |
| Comments | proc card g3ins_ soc_ v3 processor board processor- card- g3ins_ soc_ v3, number of layers: 20, thicknes , /item category g3ins mother board mother board pcb g3ins-mother- board aircrafts_ v8, number of layers: 14, thicknes g3ins mother board mother board pcb g3ins-mother- board aircrafts_v8, number of layers: 14, thickness: |
| Published Date | |
|---|---|
| Due Date | 09 Apr 2026 00:00:00 |
| Estimated Value | 0.0 |
|---|---|
| EMD | 0 INR |
| Processing Fee | 0 INR |