Integrated Processing Facility for Multi 134310816

The Centre For Materials For Electronics Technology has published a tender for "Integrated Processing Facility for Multi-Wire Saw Cut Silicon Carbide (SiC) Wafer to Epi-Readyfinish" on the 20 Dec 2025. This tender belongs to Sawing machines category. This tender is published in Hyderabad, Telangana location. The vendors interested in this tender and related Sawing machines tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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