The Indian Institute of Technology Ropar has published a tender for "Tender for Supply and Installation of Wire Bonder" on the 12 Mar 2025. This tender belongs to Wafer wire bonder category. This tender is published in Rupnagar, Punjab location. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Related categories: Plasma Asher Tenders | PCB Making System Tenders | Wafer wire bonder Tenders |
IIT Ropar issued 4 tenders for Wafer wire bonder last year
With, 0 floated just last month.
Tender Title | Tender for Supply and Installation of Wire Bonder |
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Published Date | |
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Due Date | 19 Mar 2025 00:00:00 |
Estimated Value | 0.0 |
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EMD | 0 INR |
Processing Fee | 0 INR |