Tender for Supply and Installation of Wi 117436121

The Indian Institute of Technology Ropar has published a tender for "Tender for Supply and Installation of Wire Bonder" on the 12 Mar 2025. This tender belongs to Wafer wire bonder category. This tender is published in Rupnagar, Punjab location. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Related categories: Plasma Asher Tenders | PCB Making System Tenders | Wafer wire bonder Tenders |

Did You Know?

IIT Ropar issued 4 tenders for Wafer wire bonder last year

With, 0 floated just last month.

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Tender Details
 Tender Title / Description
Tender Title Tender for Supply and Installation of Wire Bonder
 Important Dates
Published Date
Due Date 19 Mar 2025 00:00:00
 Estimate and EMD
Estimated Value 0.0
EMD 0 INR
Processing Fee 0 INR
 Tender No

TSID: 117436121

 Tender Type and Location
Tender Category
Tender Type
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