RFP for deployment linked incentive for design, de - 65707555


The has published a tender for "RFP for deployment linked incentive for design, development, manufacture, validation and deployment of two types of secure systems on chips (SoCs) using Indian owned processor based on open source ISA" on the 13 Dec 2022. This tender belongs to Electronic Components category. The vendors interested in this tender and related Electronic Components tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.

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Electronic Components tender analytics
  • A total of 7 tenders were published for Electronic Components in the Delhi State during Oct 2022
  • Centre for Development of Advanced Computing published 7 tenders for Electronic Components from Nov 2021 until Nov 2022
  • During the time period (Sep 2022 - Nov 2022), a total of 8 Electronic Components tenders were published in New Delhi district.
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     Tender Details

    Sector: Information Technology


    Published Date13 Dec 2022
    Tender Estimate Value0.0
    Due Date Login to view Due Date
    Earnest Money Deposit(EMD)INR XXXX
    Processing Fee 0
    Document Sale Start Date XX-XX-XXXX
    Document Sale End DateXX-XX-XXXX
    Tender Opening DateXX-XX-XXXX
    Tender Document Link Login to view the document
    Tender Category