RFP for deployment linked incentive for design, de - 59497351

The has published a tender for "RFP for deployment linked incentive for design, development, manufacture, validation and deployment of two types of secure systems on chips (SoCs) using Indian owned processor based on open source ISA" on the 07 Sep 2022. This tender belongs to Electronic Components category. The vendors interested in this tender and related Electronic Components tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.

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 Basic Tender Details

Sector: Information Technology

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  • A total of 5 tenders were published for Electronic Components in the Delhi State during Aug 2022
  • Centre for Development of Advanced Computing published 4 tenders for Electronic Components from Aug 2022 until Sep 2022
  • During the time period (Aug 2022 - Sep 2022), a total of 10 Electronic Components tenders were published in New Delhi district.
  •  Tender Details
    Published Date07 Sep 2022
    Tender Estimate Value0.0
    Due Date Click Here
    Earnest Money Deposit(EMD)INR XXXX
    Processing Fee 0
    Document Sale Start Date XX-XX-XXXX
    Document Sale End DateXX-XX-XXXX
    Tender Opening DateXX-XX-XXXX
    Tender Document Link Click Here
    Tender Category
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