The Department of Defence has published a tender for "Semi-Automatic Wire bonder machine" on the 01 Jul 2025. This tender belongs to Wafer wire bonder category. This tender is published in Bangalore, Karnataka location. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Related categories: Plasma Asher Tenders | PCB Making System Tenders | Wafer wire bonder Tenders |
DoD issued 0 tenders for Wafer wire bonder last year
With, 0 floated just last month.
| Tender Title | Semi-Automatic Wire bonder machine |
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| Published Date | |
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| Due Date | 23 Jul 2025 00:00:00 |
| Estimated Value | 0.0 |
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| EMD | 0 INR |
| Processing Fee | 0 INR |