Fabrication Packaging and Supply of NAA 138569299

The Department of Electronics and Information Technology(DeitY) has published a tender for "Fabrication, Packaging and Supply of NAADA 2.0 ASICs" on the 05 Mar 2026. This tender belongs to Packing Services category. This tender is published in Thiruvananthapuram, Kerala location. The vendors interested in this tender and related Packing Services tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: packaging services Tenders | clamps Tenders | compreg clamp Tenders

Did You Know?

Around 12110 tenders were floated in Kerala in the past month with major spending on road relaying Tenders, road construction Tenders, road repair Tenders

Tender Details
 Tender Title / Description
Tender Title Fabrication, Packaging and Supply of NAADA 2.0 ASICs
Tender Description cost: mpw 55 nm ulp eflash actual block size after shrink:8mm2 nre: 565 nm cmos ulp eflash nre: ip merge & lvs cost for die sawing cost: qfn40 (5mmx5mm) packaging packaging cost for 100 dies : qfn40 (5mmx5mm) (all inclusive) additinal fabrication cost for 100 dies additinal packaging cost for 100 dies
Comments cost: mpw 55 nm ulp eflash actual block size after shrink:8mm2 nre: 565 nm cmos ulp eflash nre: ip merge & lvs cost for die sawing cost: qfn40 (5mmx5mm) packaging packaging cost for 100 dies : qfn40 (5mmx5mm) (all inclusive) additinal fabrication cost for 100 dies additinal packaging cost for 100 dies
 Important Dates
Published Date
Due Date 14 Mar 2026 00:00:00
 Estimate and EMD
Estimated Value 0.0
EMD 0 INR
Processing Fee 0 INR
 Tender No

TSID: 138569299

 Tender Type and Location
Tender Category
Tender Type
WhatsApp Chat