The Department of Electronics and Information Technology(DeitY) has published a tender for "Fabrication, Packaging and Supply of NAADA 2.0 ASICs" on the 05 Mar 2026. This tender belongs to Packing Services category. This tender is published in Thiruvananthapuram, Kerala location. The vendors interested in this tender and related Packing Services tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: packaging services Tenders | clamps Tenders | compreg clamp Tenders
Around 12110 tenders were floated in Kerala in the past month with major spending on road relaying Tenders, road construction Tenders, road repair Tenders
| Tender Title | Fabrication, Packaging and Supply of NAADA 2.0 ASICs |
|---|---|
| Tender Description | cost: mpw 55 nm ulp eflash actual block size after shrink:8mm2 nre: 565 nm cmos ulp eflash nre: ip merge & lvs cost for die sawing cost: qfn40 (5mmx5mm) packaging packaging cost for 100 dies : qfn40 (5mmx5mm) (all inclusive) additinal fabrication cost for 100 dies additinal packaging cost for 100 dies |
| Comments | cost: mpw 55 nm ulp eflash actual block size after shrink:8mm2 nre: 565 nm cmos ulp eflash nre: ip merge & lvs cost for die sawing cost: qfn40 (5mmx5mm) packaging packaging cost for 100 dies : qfn40 (5mmx5mm) (all inclusive) additinal fabrication cost for 100 dies additinal packaging cost for 100 dies |
| Published Date | |
|---|---|
| Due Date | 14 Mar 2026 00:00:00 |
| Estimated Value | 0.0 |
|---|---|
| EMD | 0 INR |
| Processing Fee | 0 INR |