The Invest India has published a tender for "Request For Empanelment For ODOP Design and Packaging" on the 11 Aug 2023. This tender belongs to Packaging materials category. This tender is published in New Delhi, Delhi location. The vendors interested in this tender and related Packaging materials tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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