The Indian Institute of Technology Madras has published a tender for "IITM/SPS/WIRE BONDER/GTE/017" on the 10 Dec 2025. This tender belongs to Wafer wire bonder category. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: base frames Tenders | frames Tenders | weapon system Tenders
Related categories: Plasma Asher Tenders | PCB Making System Tenders | Wafer wire bonder Tenders |
Tamil Nadu has published 2 tenders in Wafer wire bonder in the last financial year.
Out of these, 0 were published last month.
| Tender Title | IITM/SPS/WIRE BONDER/GTE/017 |
|---|
| Published Date | |
|---|---|
| Due Date | 08 Jan 2026 14:00:00 |
| Tender Open Date |
| Estimated Value | 0.0 |
|---|---|
| EMD | 135000 INR |
| Processing Fee | 0 INR |