The Indian Institute of Technology Bhubaneswar has published a tender for "Bid in GeM for procurement of Wire Bonder under RP 523" on the 16 Jan 2026. This tender belongs to Wafer wire bonder category. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Bhubaneswar Indian Institute of Technology issued 0 tenders for Wafer wire bonder last year
With, 0 floated just last month.
| Tender Title | Bid in GeM for procurement of Wire Bonder under RP 523 |
|---|
| Published Date | |
|---|---|
| Due Date | 05 Feb 2026 00:00:00 |
| Estimated Value | 0.0 |
|---|---|
| EMD | 0 INR |
| Processing Fee | 0 INR |