Tender for Supply and Installation of Wi 113564327

The Indian Institute of Technology Ropar has published a tender for "Tender for Supply and Installation of Wire Bonder." on the 10 Jan 2025. This tender belongs to Wafer wire bonder category. This tender is published in Rupnagar, Punjab location. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Around 8306 tenders were floated in Punjab in the past month with major spending on unit paving Tenders, road construction Tenders, medicines Tenders

Tender Details
 Tender Title / Description
Tender Title Tender for Supply and Installation of Wire Bonder.
 Important Dates
Published Date
Due Date 31 Jan 2025 00:00:00
 Estimate and EMD
Estimated Value 0.0
EMD 0 INR
Processing Fee 0 INR
 Tender No

TSID: 113564327

 Tender Type and Location
Tender Category
Tender Type
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