VR prototype Development AR Device Integ 159277416

The Department of Higher Education has published a tender for "VR prototype Development AR Device Integrated System,AI Development Kits,3D Lidar Sensor,Raspberry Pi Robotics Kits,Temperature and Humadity Sensor,Vibration Sensor,MQ Series Sensor 1 to 7,Force Sensor,Pressure Sensor,Network Storage NAS,Server or Cloud Node,Protype Device Board" on the 15 Oct 2026. This tender belongs to Electronic Components category. This tender is published in Bhopal, Madhya Pradesh location. The vendors interested in this tender and related Electronic Components tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Madhya Pradesh has published 362 tenders in Electronic Components in the last financial year.

Out of these, 25 were published last month.

Tender Details
 Tender Title / Description
Tender Title VR prototype Development AR Device Integrated System,AI Development Kits,3D Lidar Sensor,Raspberry Pi Robotics Kits,Temperature and Humadity Sensor,Vibration Sensor,MQ Series Sensor 1 to 7,Force Sensor,Pressure Sensor,Network Storage NAS,Server or Cloud Node,Protype Device Board
Tender Description VR prototype Development AR Device Integrated System , AI Development Kits , 3D Lidar Sensor , Raspberry Pi Robotics Kits , Temperature and Humadity Sensor , /Item Category Vibration Sensor , MQ Series Sensor 1 to 7 , Force Sensor , Pressure Sensor , Network Storage NAS , Server or Cloud Node , Protype Device Board VR prototype Development VR AR Device integrated system, NVIDIA Jetson AGX AI Kits, 3D Lidar Sensor,
Comments VR prototype Development AR Device Integrated System , AI Development Kits , 3D Lidar Sensor , Raspberry Pi Robotics Kits , Temperature and Humadity Sensor , /Item Category Vibration Sensor , MQ Series Sensor 1 to 7 , Force Sensor , Pressure Sensor , Network Storage NAS , Server or Cloud Node , Protype Device Board VR prototype Development VR AR Device integrated system, NVIDIA Jetson AGX AI Kits, 3D Lidar Sensor,
 Important Dates
Published Date
Due Date 05 Nov 2026 17:00:00
 Estimate and EMD
Estimated Value 31.27 Lakh
EMD 0 INR
Processing Fee 0 INR
 Tender No

TSID: 159277416

 Tender Type and Location
Tender Category
Location/Region
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