DICED SUBSTRATES FOR THIN FILMS 134873621

The Directorate of Purchase and Stores has published a tender for "DICED SUBSTRATES FOR THIN FILMS" on the 30 Dec 2025. This tender belongs to Semiconductor wafers category. This tender is published in Indore, Madhya Pradesh location. The vendors interested in this tender and related Semiconductor wafers tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Related categories: Semiconductor wafers Tenders | Integrated circuit packages Tenders | Integrated Circuit Sockets Tenders |

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Tender Details
 Tender Title / Description
Tender Title DICED SUBSTRATES FOR THIN FILMS
Tender Description /item category diced substrates for thin films
Comments /item category diced substrates for thin films
 Important Dates
Published Date
Due Date 21 Jan 2026 00:00:00
 Estimate and EMD
Estimated Value 0.0
EMD 0 INR
Processing Fee 0 INR
 Tender No

TSID: 134873621

 Tender Type and Location
Tender Category
Tender Type
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