Manual Wire bonder 127210052 INR 0 0

The Director-Indian Institute of Technology(IIT Delhi) has published a tender for "Manual Wire-bonder" on the 10 Sep 2025. This tender belongs to Wafer wire bonder category. This tender is published in New Delhi, Delhi location. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: base frames Tenders | frames Tenders | weapon system Tenders
Related categories: Semiconductor process system Tenders | Plasma Asher Tenders | PCB Making System Tenders |

Did You Know?

Delhi has published 0 tenders in Wafer wire bonder in the last financial year.

Out of these, 0 were published last month.

Tender Details
 Tender Title / Description
Tender Title Manual Wire-bonder
 Important Dates
Published Date
Due Date 08 Oct 2025 00:00:00
 Estimate and EMD
Estimated Value 0.0
EMD 0 INR
Processing Fee 0 INR
 Tender No

TSID: 127210052

 Tender Type and Location
Tender Category
Tender Type
WhatsApp Chat