The Indian Institute of Science has published a tender for "Request for Quote (RFQ) from domestic (India-based) vendors, for the supply and installation of a Flip Chip Bonder." on the 01 Jul 2022. This tender belongs to Electronic Manufacturing Machine category. This tender is published in Bangalore, Karnataka location. The vendors interested in this tender and related Electronic Manufacturing Machine tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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IISc issued 5 tenders for Electronic Manufacturing Machine last year
With, 0 floated just last month.
| Tender Title | Request for Quote (RFQ) from domestic (India-based) vendors, for the supply and installation of a Flip Chip Bonder. |
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| Published Date | |
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| Due Date | 20 Jul 2022 00:00:00 |
| Estimated Value | 0.0 |
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| EMD | 0 INR |
| Processing Fee | 0 INR |