Wafer Grinding System 116396793 INR 0 0

The Indian Space Research Organisation has published a tender for "Wafer Grinding System" on the 21 Feb 2025. This tender belongs to Grinding machines category. The vendors interested in this tender and related Grinding machines tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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ISRO issued 2 tenders for Grinding machines last year

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Wafer Grinding System 116396793 INR 0 0

TSID: 116396793 Bangalore

Published Date
21 Feb 2025
Submission Deadline
21 Mar 2025 00:00
Estimated Value
β‚Ή 0.0
EMD
β‚Ή 0

Tender Information

Tender Title
Wafer Grinding System
Tender Description
Tender Number
Purchasing Agency
Tender Category

Grinding machines
Tender Location
Bangalore
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