The has published a tender for "Diamond impregnated wafering blade 5 inch outer dia X 0.015 inch thickness X 0.5 inch central hole,Diamond impregnated wafering blades 6 inch outer dia X 0.020 inch thickness X 0.5 inch central hole,Diamond impregnated wafering blades 7 inch outer dia X 0.025 inch thickness X 0.5 inch central hole" on the 07 Mar 2024. This tender belongs to Cutting Tool category. The vendors interested in this tender and related Cutting Tool tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Sector: Defense
Ministry of Defence
Department of Defence
Defence Intelligence Agency
Integrated Defence Staff
Dir. Gen. Defence Estates,HQ
Department of Defence Production
IHQ of MOD(Navy)