Details: electronicsubsystems mechanicalpackagedesign,structuraland thermalanalysisreport, si &pi report asper attachedrfp1.00 nos. -tender no : sac/cpur/sa202500038901 page 12of142electronicsubsystems dvm unitof on-boardprocessingunit as perattached rfp1.00 nos. -3electronicsubsystems fm unit ofon-boardprocessingunit as perattached rfp1.00 nos. -4electronicsubsystems qm unit ofon-boardprocessingunit as perattached rfp1.00 nos. -5electronicsubsystems spare fmunit of onboardprocessingunit as perattached rfp1.00 nos
Sector: Remote Sensing and Geospatial