The Department of Higher Education has published a tender for "Wafer Dicing Equipment" on the 26 Dec 2024. This tender belongs to Dicing machine category. This tender is published in Bhopal, Madhya Pradesh location. The vendors interested in this tender and related Dicing machine tenders can obtain further details by exploring Tendersniper web portal. Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
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Related categories: Slicing machine Tenders | Chopping machine Tenders | Cutting machinery Tenders |
Department of Higher Education issued 1 tenders for Dicing machine last year
With, 0 floated just last month.
| Tender Title | Wafer Dicing Equipment |
|---|
| Published Date | |
|---|---|
| Due Date | 16 Jan 2025 00:00:00 |
| Estimated Value | 0.0 |
|---|---|
| EMD | 0 INR |
| Processing Fee | 0 INR |