The has published a tender for "Inductively coupled Plasma-Reactive Ion Etching (ICP-RIE) Equipment for 4-inch wafer processing" on the 21 May 2020. This tender belongs to RIE System category. The vendors interested in this tender and related RIE System tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: reactive ion etching system Tenders | plasma ashing system Tenders | inductively coupled plasma icp Tenders Related categories: Semiconductor process systems | Plasma Asher | PCB Making System | Wafer wire bonder | Vacuum Impregnation Sealing Device | RIE System | Automatic Semiconductor Coater |
Sector: Science University
Indian Institute of Technology Jammu
Indian Institute of Technology Indian School of Mines Dhanbad
Director-Indian Institute of Technology(IIT Delhi)
Indian Institute of Technology Mandi
Indian Institute of Technology
ABV- Indian Institute of Information Technology and Management
Indian Institute of Technology Bhubaneswar