The has published a tender for "Supply of 4 or more layer custom PCB as per the schematic design provided by VECC, and an enclosure box. The job will require layout design, fabrication, and semi-automatic assembly PCB components, cutting of slots in enclosure box, metal printing and assembly of components as per the indicative design provided by VECC." on the 01 Jul 2021. This tender belongs to Fabrication of pcb category. The vendors interested in this tender and related Fabrication of pcb tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: printed circuit board or pcb Tenders | pcb design services Tenders | fabrication of boiler Tenders Related categories: Heat sinks | Semiconductor wafers | Integrated circuit packages | Integrated Circuit Sockets | Heat sink compounds | Insulators for Heat Sinks | Bare PCB | Sputtering targets | Photo mask | Bare Flexible PCB |
Sector: Renewable Energy