The has published a tender for "Integrated Microsectioning System for Multilayer Printed Circuit Boards" on the 12 Jul 2021. This tender belongs to Multilayer Bare PCB category. The vendors interested in this tender and related Multilayer Bare PCB tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: elecronic equipments Tenders | printed circuit board or pcb Tenders | pcb design or pcb prototype machine Tenders Related categories: Heavy Layer Copper Bare PCB | Semiconductor wafers | Integrated circuit packages | Integrated Circuit Sockets | Heat sink compounds | Insulators for Heat Sinks | Bare PCB | Sputtering targets | Double Sided Bare PCB |
Sector: Remote Sensing and Geospatial
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