The has published a tender for "Thick Film Hybrid Micro Circuits Fabrication" on the 14 Nov 2019. This tender belongs to Integrated circuits category. The vendors interested in this tender and related Integrated circuits tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: electrical equipments Tenders | elecronic equipments Tenders | internet of things Tenders Related categories: RAM | SRAM | PROM | EEPROM | Monolithic Memory ICs | ROM | Application Specific ICs | Programmable Array Logic | Gate Array Logic | Bipolar CMOS Technology | Digital integrated circuits |
Sector: Remote Sensing and Geospatial
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