The has published a tender for "RC for Sintering nickel Plating and Brazing" on the 19 Jul 2019. This tender belongs to Ceramic for PCB Substrates category. The vendors interested in this tender and related Ceramic for PCB Substrates tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: elecronic equipments Tenders | printed circuit board or pcb Tenders | ac distribution boards Tenders Related categories: Semiconductor wafers | Integrated circuit packages | Heat sink compounds | Insulators for Heat Sinks | Bare PCB | Sputtering targets | Photo mask | Double Sided Bare PCB | Heavy Layer Copper Bare PCB |
Sector: Remote Sensing and Geospatial
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