The has published a tender for "Wafer Dicing Tool" on the 21 May 2020. This tender belongs to Sawing machines category. The vendors interested in this tender and related Sawing machines tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business. Related alert: machines Tenders | bandsaw machine Tenders | industrial machinery and tools corporation Tenders
Sector: Science University
Indian Institute of Technology Indian School of Mines Dhanbad
Director-Indian Institute of Technology(IIT Delhi)
Indian Institute of Technology Mandi
Indian Institute of Technology
ABV- Indian Institute of Information Technology and Management
Indian Institute of Technology Bhubaneswar
Indian Institute of Technology Guwahati