The has published a tender for "Semi-Automatic Wire Bonder" on the 21 May 2020. This tender belongs to Wafer wire bonder category. The vendors interested in this tender and related Wafer wire bonder tenders can obtain further details by registering in the Tendersniper web portal. Upon registration, Tendersniper sends regular tender alerts by email specifically addressing the user requirements (i.e., keywords, location and value range). Government business is a growing area of opportunity. The businesses are encouraged to actively monitor tender opportunities and participate in them to grow their business.
Related alert: base frames Tenders | frames Tenders Related categories: Semiconductor process systems | Plasma Asher | PCB Making System | Wafer wire bonder | Vacuum Impregnation Sealing Device | Vacuum Impregnation Sealing Device Repair | RIE System | Automatic Semiconductor Coater |
Sector: Science University
Indian Institute of Technology Indian School of Mines Dhanbad
Director-Indian Institute of Technology(IIT Delhi)
Indian Institute of Technology Mandi
Indian Institute of Technology
ABV- Indian Institute of Information Technology and Management
Indian Institute of Technology Patna
Indian Institute of Technology Bhubaneswar